Manufacturing process of aluminum substrate
Manufacturing process of aluminum substrate: aluminum substrate is a kind of metal copper clad plate with good heat dissipation. Generally, the single plate is of three-layer structure, including circuit layer (copper foil), insulation layer and metal substrate. It is also applicable to high-end occasions, such as circuit layer, insulation layer, aluminum base, insulation layer, circuit layer, etc. It is rarely used as multilayer board, and can be bonded with ordinary multilayer board, insulating layer and aluminum base adhesive.
LED aluminum substrate is PCB, which is also the meaning of printed circuit board. It is only that the material of the circuit board is aluminum alloy. Previously, we generally used glass fiber as the circuit board. But because of the high heat of LED, the circuit board used for LED lamps is generally aluminum base, which can conduct heat quickly. Other equipment or electrical circuit boards are still glass fiber boards!
The aluminum substrate can be reduced to the minimum thermal resistance value, which makes the aluminum substrate have good thermal conductivity. Compared with the thick film ceramic circuit, its mechanical properties are very excellent.
In addition, aluminum substrate has the following unique advantages:
Meet RoHs standards;
More suitable for SMT process;
The heat dissipation problem in the circuit design scheme shall be handled extremely effectively to reduce the working temperature of the module, extend the service life, and improve the power density and reliability;
Reduce the assembly of radiators and other hardware equipment (including thermal interface materials), reduce product volume, and reduce hardware and assembly costs; Optimize the combination of power circuit and control circuit;
It can replace fragile ceramic substrate and improve mechanical durability.
The aluminum base material (metal base heat sink (including aluminum base material and copper base material) is a low alloyed Al-Mg-Si series high plastic alloy plate (see the following figure for structure), which has good thermal conductivity, good electrical insulation performance and good mechanical processing performance. The thickness and line width of the aluminum base plate are the same as those of the traditional FR-4 plate. The aluminum base plate can withstand higher current. The aluminum base plate can withstand 4500V, and the thermal conductivity is more than 2.0. The aluminum base plate is mainly used in industry.
Use surface mounting technology (SMT);
·Deal with the heat diffusion in circuit design very efficiently;
Reduce the operating temperature of the product, improve the power density and reliability of the product, and extend the service life of the product;
*Reduce product volume, reduce hardware and assembly costs;
·Replace the friable ceramic substrate to make it have better mechanical durability.
Aluminum copper clad plate is a kind of metal circuit board material. Its structure is divided into three layers: copper foil, heat conduction insulation layer and metal substrate.
Cireuitl.Layer wire layer: copper clad sheet equivalent to ordinary PCB, the thickness of copper foil used online is loz to 10oz.
Insulation layer: The insulation layer is a thermal insulation material with low thermal resistance. The thickness of aluminum copper clad plate varies from 0.003 "to 0.006" inch and has passed UL certification.
BaseLayer base: It is a metal base, usually aluminum or copper. Aluminum alloy copper clad plate and traditional epoxy glass cloth, etc.