News

What is the density of epoxy board

2023-11-29

The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain. The epoxy groups can be located at the end, middle or ring structure of the molecular chain. They can cross-link with various types of curing agents to form insoluble, non-fusible polymers with three-dimensional network structure, with specification thickness of 0.5 to 100 mm, and are subject to thermal deformation at high temperature of 180 ℃. Generally, they are not heated together with other metals, which may cause metal sheet deformation.

Detail →

Is epoxy board resistant to high temperature? What are the characteristics of epoxy board

2023-11-29

Epoxy board can also be used in the decoration design at this stage, and is often used in the decoration design at this stage, but is the epoxy board resistant to high temperature? As more and more people use epoxy panels, we will also be very curious about the characteristics of epoxy panels. In order to further understand the epoxy board, what are the characteristics of the epoxy board?

Detail →

What kind of material does epoxy board belong to

2023-11-29

Epoxy board, also known as epoxy glass fiber board, is made by bonding epoxy resin and heating and pressing.

Detail →

What are the heating membranes of new energy power batteries?

2023-11-29

First of all, the working principle of the heating film of the new energy vehicle battery is that the low temperature causes the increase of the internal resistance of the battery. By installing a device that can generate oscillating current at both ends of the battery, the current can pass through the cell with large internal resistance, so that a large amount of heat can be generated inside the battery. At last, the temperature of the battery will rise rapidly. The heating film commonly used for the new energy battery includes: silica gel heating film, PI heating film, and epoxy plate heating film. According to the application requirements, these three types are relatively common, the difference is:; The temperature resistance of silica gel heating film can reach 250 ℃, the product thickness is 1.6 ± 0.2mm, and the pressure resistance is 2500V/1Min; The temperature resistance of PI heating film is 180 degrees, the product thickness is 0.3-0.5mm, and the pressure resistance is AC1500V/1Min; The epoxy plate heating film has a temperature resistance of 180 degrees, a thickness of 0.8-2mm, and a pressure resistance of 2500V/1Min. The actual application can be customized according to the specific use.

Detail →

Manufacturing process of aluminum substrate

2023-11-29

Aluminum substrate is a kind of metal copper clad plate with good heat dissipation. Generally, the single plate is a three-layer structure, which is composed of circuit layer (copper foil), insulation layer and metal substrate. It is also applicable to high-end occasions, such as circuit layer, insulation layer, aluminum base, insulation layer, circuit layer, etc. It is rarely used as multilayer board, and can be bonded with ordinary multilayer board, insulating layer and aluminum base adhesive.

Detail →

Understand the judgment and selection of copper clad plate

2023-11-29

Through hole is one of the important components of multilayer PCB. We have introduced the meaning and characteristics of through hole, blind hole and buried hole in HDI board and how to judge the reliability of blind hole in the last issue of Through Hole Knowledge in High-density PCB Circuit Board Design.

Detail →